MOSFET 100 Amps 100V 0.0125 Rds
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Features: · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mount...
| Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 100 V | ||
| Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 80 A | ||
| Resistance Drain-Source RDS (on) : | 0.0125 Ohms | Configuration : | Single | ||
| Maximum Operating Temperature : | + 150 C | Mounting Style : | SMD/SMT | ||
| Package / Case : | ISOPLUS 220 | Packaging : | Tube |
| Symbol | Conditions | Maximum | Ratings |
| VCES | TJ = 25 to 150 | 100 | v |
| VCGR | TJ = 25 to 150; RGE = 1K | 100 | v |
| VGES | Continuous | ±20 | V |
| VGEM | Transient | ±30 | V |
| IC25 | TC = 25, | 60 | A |
| IC90 | TC = 90 | 35 | A |
| ICM | TC = 90°C,tp= 1 ms | 70 | A |
| RBSOA | VGE= 15 V, TVJ = 125, RG = 10 Clamped inductive load, L = 30 H |
ICM =110 VCEK < VCES |
A |
| TSC (SCSOA) |
VGE = 15 V, VCES = 1200V, TJ = 125°C RG = 10 Ω non repetitive |
10 | µs |
| PC | TC = 25IGBT Diode |
250 80 |
W W |
| TJ | -55 ... +150 | ||
| TJM | -55 ... +150 | ||
| Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s |
300 | ||
| Md | Mounting torque TO-220 TO-247 |
0.4 - 0.6 0.8 - 1.2 |
Nm Nm |
| Weight | TO-247 | 6 |
g |
| Technical/Catalog Information | IXFC80N10 |
| Vendor | IXYS |
| Category | Discrete Semiconductor Products |
| Mounting Type | Through Hole |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 100V |
| Current - Continuous Drain (Id) @ 25° C | 80A |
| Rds On (Max) @ Id, Vgs | 12.5 mOhm @ 40A, 10V |
| Input Capacitance (Ciss) @ Vds | 4800pF @ 25V |
| Power - Max | 230W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 180nC @ 10V |
| Package / Case | ISOPLUS220? |
| FET Feature | Standard |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IXFC80N10 IXFC80N10 |