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Part Number: K9XXG08UXM

 

 

 

 

Description: Offered in 1Gx8bit, the K9L8G08U0M is a 8G-bit NAND Fla...


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K9XXG08UXM General Description


Offered in 1Gx8bit, the K9L8G08U0M is a 8G-bit NAND Flash Memory with spare 256M-bit. Its NAND cell provides the most costeffective solution for the solid state mass storage market. A program operation can be performed in typical 950s on the 2,112-byte page and an erase operation can be performed in typical 1.5ms on a (256K+8K)byte block. Data in the data register can be read out at 30ns(K9MBG08U5M:50ns) cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9L8G08U0Ms extended reliability of 1.5K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9L8G08U0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

An ultra high density solution having two 8Gb stacked with two chip selects is also available in standard TSOPI package and another ultra high density solution having two 16Gb TSOPI package stacked with four chip selects is also available in TSOPI-DSP.

K9XXG08UXM Maximum Ratings

Parameter
Symbol
Rating
Unit
Voltage on any pin relative to VSS
VCC
-0.6 to + 4.6
V
VIN
-0.6 to + 4.6
VI/O
-0.6 to Vcc+0.3 (<4.6V)
Temperature Under Bias K9XXG08UXM-XCB0
TBIAS
-10 to +125
°C
K9XXG08UXM-XIB0
-40 to +125
Storage Temperature K9XXG08UXM-XCB0
TSTG
-65 to +150
°C
K9XXG08UXM-XIB0
Short Circuit Current
IOS
5
mA

NOTE :
1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

K9XXG08UXM Features

• Voltage Supply : 2.7 V ~ 3.6 V
• Organization
- Memory Cell Array : (1G+ 32M)bit x 8bit
- Data Register : (2K + 64)bit x8bit
• Automatic Program and Erase
- Page Program : (2K + 64)Byte
- Block Erase : (256K + 8K)Byte
• Page Read Operation
- Page Size : (2K + 64)Byte
- Random Read : 50s(Max.)
- Serial Access : 30ns(Min.)
*K9MBG08U5M : 50ns(Min.)
• Memory Cell : 2bit / Memory Cell
• Fast Write Cycle Time
- Program time : 950s(Typ.)
- Block Erase Time : 1.5ms(Typ.)
• Command/Address/Data Multiplexed I/O Port
• Hardware Data Protection
- Program/Erase Lockout During Power Transitions
• Reliable CMOS Floating-Gate Technology
- Endurance : 1.5K Program/Erase Cycles􀀉with 3bit/512Byte ECC)
- Data Retention : 5 Years
• Command Register Operation
• Unique ID for Copyright Protection
• Package :
- K9L8G08U0M-YCB0/YIB0
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9L8G08U0M-PCB0/PIB0 : Pb-FREE PACKAGE
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9HAG08U1M-YCB0/YIB0 : Two K9L8G08U0M stacked
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9HAG08U1M-PCB0/PIB0 : Pb-FREE PACKAGE
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9MBG08U5M-YCB0/YIB0 : Two K9HAG08U0M package stacked
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9MBG08U5M-PCB0/PIB0 : Pb-FREE PACKAGE
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)

K9XXG08UXM Connection Diagram

K9XXG08UXM  Connection Diagram

K9XXG08UXM datasheet

K9XXG08UXM-E
PDF/DataSheet Download

  • Datasheet: K9XXG08UXM-E
  • File Size: 696380 KB
  • Manufacturer: SAMSUNG [Samsung semiconductor]
  • Click here to Download

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