KBP2010G

Features: · Glass Passivated Die Construction· Low Forward Voltage Drop · High Current Capability· High Reliability· High Surge Current Capability · Ideal for Printed Circuit BoardsSpecifications Characteristic Symbol KBP200G KBP201G KBP202G KBP204G KBP206G KBP208G K...

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SeekIC No. : 004384388 Detail

KBP2010G: Features: · Glass Passivated Die Construction· Low Forward Voltage Drop · High Current Capability· High Reliability· High Surge Current Capability · Ideal for Printed Circuit BoardsSpecifications ...

floor Price/Ceiling Price

Part Number:
KBP2010G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

· Glass Passivated Die Construction
· Low Forward Voltage Drop
· High Current Capability
· High Reliability
· High Surge Current Capability
· Ideal for Printed Circuit Boards





Specifications

Characteristic
Symbol
KBP
200G
KBP
201G
KBP
202G
KBP
204G
KBP
206G
KBP
208G
KBP
210G
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
100
200
400
600
800
1000
V
RMS Reverse Voltage
VR(RMS)
35
70
140
280
420
560
700
V
Average Rectified Output Current
@TA = 50°C
IO
2.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
60
A
Forward Voltage (per diode) @IF = 2.0A
VFM
1.1
V
TPeak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TC = 100°C
IRM
5.0
500
A
Rating for Fusing (t<8.3ms)
I2t
15
A2s
Typical Thermal Resistance
CJ
25
pF
Typical Thermal Resistance (Note )
RJA
30
K/W
Operating and Storage Temperature Range
Tj,TSTG
-55 to +165

°C


Note: 1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance junction to ambient mounted on PC board with 12mm2 copper pad.






Description

This is the description about KBP200G to KBP2010G of 2.0A glass passivated single-phase bridge rectifier.
Here are the features: Glass Passivated Die Construction; Low Forward Voltage Drop; High Current Capability; High Reliability; High Surge Current Capability; Ideal for Printed Circuit Boards; Recognized File # E157705.
This is the Mechanical Data of KBP2010G . The Case is KBPM, Molded Plastic. The Terminals is Plated Leads Solderable per MIL-STD-202, Method 208 E. The Polarity is As Marked on Body. The Weight is 1.7 grams (approx.). The Mounting Position is any. The Marking is Type Number. Lead Free is for RoHS / Lead Free Version, Add "-LF" Suffix to Part Number.
The Maximum Ratings and Electrical Characteristics of KBP2010G  are these (@TA=25°C unless otherwise specified, Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.). Average Rectified Output Current @TA = 55°C is 2.0 A. Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) is 60 A. Forward Voltage per leg @IF = 2.0A is 1.1 V. Peak Reverse Current @TA = 25°C is5.0 A; At Rated DC Blocking Voltage @TA = 125°C is 500 A. Rating for Fusing (t<8.3ms) is 15 A2s. Typical Junction Capacitance per leg (Note 1) is 25 pF. Typical Thermal Resistance per leg (Note 2) ( RJA) is 30 °C/W and (RJL) is 11 °C/W. Operating and Storage Temperature Range is from -55 to +165 °C. Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C. 2. Mounted on PC board with 12mm2 copper pad.
At present there is not too much information about this model. If you are willing to find more about the KBP200G KBP2010G, please pay attention to our web! We will promptly update the relevant information. You can find it in www.ChinaICMart.com or www.seekic.com. Welcome to contact with us.






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