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MFG:RENESAS  Package Cooled:02+  D/C:DIP  

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Part Number: M66700P

 

MFG: RENESAS

Package Cooled: 02+

D/C: DIP

Description: M66700 Semiconductor Integrated Circuit is built in facsimiles and photocopiers to drive CCD linear im...


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M66700P General Description


M66700 Semiconductor Integrated Circuit is built in facsimiles and photocopiers to drive CCD linear image sensor data
transfer clocks at high speeds. Because this IC takes in data on the TTL (Transistor-transistor logic) level, it can be driven  directly by a TTL integrated circuit.

M66700P Maximum Ratings

Symbol
Parameter
Conditions
Ratings
Unit
Vcc Supply voltage
 
-0.5to+15
V
VI Input voltage  
-0.5to+15
V
Vo Output voltage Output: "H"
Vcc
V
Pd Power dissipation For single integrated
circuit; Ta = 25°C (Note 1)
950 (P) /1800 (WP)
mW
Tstg Storage temperature  
-65 to +150
°C
Note 1: When Ta is 25°C or higher, conduct derating as follows: 7.7mW/C° (P) /14.4mW/°C (WP).

M66700P Features

• Output logic amplitude: 12V
• High-speed rise/fall time
         tr = tf = 33ns (typical)
         CL = 1000pF
• High output "H" level voltage: (VCC 1) V minimum
• Low output "L" level voltage: 0.5V maximum
• TTL input level
• Package with improved allowable power dissipation (WP) characteristic

M66700P Typical Application

Driving of CCD image sensors in facsimiles, image scanners and photocopiers

M66700P Connection Diagram

M66700P  Connection Diagram

M66700P datasheet

M66700P
PDF/DataSheet Download

  • Datasheet: M66700P
  • File Size: 73544 KB
  • Manufacturer: MITSUBISHI [Mitsubishi Electric Semiconductor]
  • Click here to Download

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