MAX2821A

V_CC Pins to GND ...............................................-0.3V to +4.2V
RF Inputs: RX_RFP, RX_RFN to GND.........-0.3V to (V_CC + 0.3V)
RF Outputs: TX_RFP, TX_RFN to GND..................-0.3V to +4.2V
Baseband Inputs: TX_BBIP, TX_BBIN, TX_BBQP,
TX_BBQN to GND ......................................-0.3V to (V_CC + 0.3V)
Baseband Outputs: RX_BBIP, RX_BBIN, RX_BBQP,
RX_BBQN to GND.......................................-0.3V to (V_CC + 0.3V)
Analog Inputs: RX_AGC, TX_GC, TUNE, ROSCN,
ROSCP to GND ..........................................-0.3V to (V_CC + 0.3V)
Analog Outputs: PA_BIAS, CP_OUT, VREF
to GND.......................................................-0.3V to (V_CC + 0.3V)
Digital Inputs: RX_ON, TX_ON, SHDNB, CSB, SCLK,
DIN, RF_GAIN, RX_1K to GND.....................-0.3V to (V_CC + 0.3V)
Bias Voltages: RBIAS, BYP ..................................+0.9V to +1.5V
Short-Circuit Duration Digital Outputs: DOUT, RX_DET .........10s
RF Input Power: RX_RFN, RX_RFP...................................+10dBm
Continuous Power Dissipation (T_A = +70°C)
48-Lead QFN (derate 27.0mW/°C above +70°C)........2162mW
48-Lead Thin QFN (derate 38.5mW/°C
above +70°C)................................................................3077mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature.......................................................+150°C
Storage Temperature Range ............................-65°C to +160°C
Lead Temperature (soldering, 10s) ..................................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.