Features: ·Lead Formed for Surface Mount Applications in Plastic Sleeves·Pb-Free Packages are AvailableSpecifications SYMBOL PARAMETER RATING UNIT VCBO Collector to base voltageMJD31,MJD32 MJD31C,MJD32C 40100 V VCE Collector to emitter voltageMJD31,MJD32 MJD31C,MJD32C 40100 V ...
MJD31: Features: ·Lead Formed for Surface Mount Applications in Plastic Sleeves·Pb-Free Packages are AvailableSpecifications SYMBOL PARAMETER RATING UNIT VCBO Collector to base voltageMJD31,MJD...
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| SYMBOL | PARAMETER | RATING | UNIT |
| VCBO | Collector to base voltage MJD31,MJD32 MJD31C,MJD32C |
40 100 |
V |
| VCE | Collector to emitter voltage MJD31,MJD32 MJD31C,MJD32C |
40 100 |
V |
| VEB | Emitter to base voltage | 5 | V |
| IC | Collector current | 3 | A |
| ICP | Collector current (pulse) | 5 | A |
| IB | base current | 1 | A |
| PD | Total Device Dissipation FR-5 Board @TA = 25 Derate above 25 |
15 0.12 |
W W/ |
| PD | Total Device Dissipation Alumina Substrate @TA = 25 Derate above 25 |
1.56 0.012 |
W W/ |
| Tstg | Storage temperature | -65 to +150 | |
| Tj | Junction temperature | 150 | |
| RèJC | Thermal Resistance, Junction-to-Case | 8.3 | W/ |
| RèJA | Thermal Resistance, Junction-to-Ambient | 80 | W/ |
| TL | Lead Temperature for Soldering Purposes | 260 |