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MR18R326GAG0

Features: `High speed up to 1066 MHz RDRAM storage`184 edge connector pads with 1mm pad spacing`Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25 x 1.375 x 0.05 )`Each RDRAM device has 32 banks, for a total of 512 banks on 1.1GB module`Gold plated edge connector pad contacts`Serial Presence De...

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SeekIC No. : 004426564 Detail

MR18R326GAG0: Features: `High speed up to 1066 MHz RDRAM storage`184 edge connector pads with 1mm pad spacing`Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25 x 1.375 x 0.05 )`Each RDRAM device has 32 banks,...

MR18R326GAG0 Data Sheet

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Part Number:
MR18R326GAG0
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

`High speed up to 1066 MHz RDRAM storage
`184 edge connector pads with 1mm pad spacing
`Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25" x 1.375" x 0.05")
`Each RDRAM device has 32 banks, for a total of 512 banks on 1.1GB module
`Gold plated edge connector pad contacts
`Serial Presence Detect(SPD) support
`Operates from a 2.5 volt supply (±5%)
`Powerdown self refresh modes
`Separate Row and Column buses for higher efficiency
`WBGA lead free package (92 balls)


Specifications

Symbol Parameter
Min
Max
Unit
VI,ABS Voltage applied to any RSL or CMOS signal pad with respect to Gnd
- 0.3
VDD + 0.3
V
V DD,ABS Voltage on VDD with respect to Gnd
- 0.5
VDD + 1.0
V
TSTORE Storage temperature
- 50
100
°C
TPLATE Plate temperature
-
92
°C



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