MX29LV002NC General Description
MX29LV002NC Maximum Ratings
Storage Temperature
Plastic Packages . . . . . . . . . . . . ... ...... -65 to +150
Ambient Temperature
with Power Applied. . . . . . . . . . . . . ..... -65 to +125
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . ... . -0.5 V to +4.0 V
A9, OE#, and
RESET# (Note 2) . . . . . . . . . . . ......-0.5 V to +12.5 V
All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . .0. . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input or I/O pins may overshoot
VSS to -2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During
voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#,
and RESET# may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC input voltage on pin A9 is
+12.5 V which may overshoot to 14.0 V for periods up to 20 ns. The RESET# pin is provided for 40-pin TSOP
package type.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater
than one second.
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated
in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.
MX29LV002NC Features
• Ready/Busy# pin (RY/BY#)
- Provides a hardware method of detecting program or erase operation completion.
• Sector protection
- Hardware method to disable any combination of sectors from program or erase operations
- Temporary sector unprotect allows code changes in previously locked sectors
• CFI (Common Flash Interface) compliant
- Flash device parameters stored on the device and provide the host system to access
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Boot Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Hardware RESET# pin (only for 29LV002C)
- Resets internal state machine to read mode
• Package type:
- 32-pin TSOP (type 1)
- 32-pin PLCC
• 20 years data retention
• Extended single - supply voltage range 2.7V to 3.6V
• 262,411 x 8
• Single power supply operation
- 3.0V only operation for read, erase and program operation
• Fast access time: 70/90ns
• Low power consumption
- 20mA maximum active current
- 0.2uA typical standby current
• Command register architecture
- Byte Programming (9us typical)
- Sector Erase (Sector structure 16K-Byte x 1, 8K-Byte x 2, 32K-Byte x1, and 64K-Byte x3)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with Erase Suspend capability.
- Automatically program and verify data at specified address
• Erase suspend/Erase Resume
- Suspends sector erase operation to read data from, or program data to, any sector that is not being erased,
then resumes the erase.
• Status Reply
- Data# Polling & Toggle bit for detection of program and erase operation completion.
MX29LV002NC Connection Diagram

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