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RF1S540SM

Features: • 28A, 100V• rDS(ON) = 0.077• Single Pulse Avalanche Energy Rated• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Speci...

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SeekIC No. : 004476158 Detail

RF1S540SM: Features: • 28A, 100V• rDS(ON) = 0.077• Single Pulse Avalanche Energy Rated• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance...

RF1S540SM Data Sheet

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Part Number:
RF1S540SM
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/27

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Product Details

Description



Features:

• 28A, 100V
• rDS(ON) = 0.077
• Single Pulse Avalanche Energy Rated
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

IRF540, RF1S540SM UNITS
Drain to Source Voltage (Note 1) VDS 100 V
Drain to Gate Voltage (RGS = 20k) (Note 1) VDGR 100 V
Continuous Drain Current ID 28 A
TC = 100 ID 20 A
Pulsed Drain Current (Note 3) IDM 110 A
Gate to Source Voltage VGS ±20 V
Maximum Power Dissipation PD 120 W
Linear Derating Factor 0.8 W/
Single Pulse Avalanche Energy Rating (Note 4) EAS 230 mJ
Operating and Storage Temperature TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL 300
Package Body for 10s, See Techbrief 334 Tpkg 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25toTJ = 125.


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