Features: • 70A, 30V• r DS(ON) = 0.010W• Temperature Compensating PSPICE® Model• Peak Current vs Pulse Width Curve• UIS Rating Curve (Single Pulse)• 175oC Operating Temperature• Related Literature - TB334 Guidelines for Soldering Surface Mount Compone...
RF1S70N03SM: Features: • 70A, 30V• r DS(ON) = 0.010W• Temperature Compensating PSPICE® Model• Peak Current vs Pulse Width Curve• UIS Rating Curve (Single Pulse)• 175oC Ope...
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| UNITS | |||
| Drain to Source Voltage (Note 1) | VDSS | 30 | V |
| Drain to Gate Voltage (RGS = 20kW)(Note 1) | VDGR | 30 | V |
| Gate to Source Voltage | VGS | ±20 | V |
| Continuous Drain Current (Figure 2) | ID | 70 | A |
| Pulsed Drain Current | IDM | 200 | A |
| Pulsed Avalanche Rating | EAS | Figure 5,13,14 | |
| Power Dissipation | PD | 150 | W |
| Derate Above 25 | 1.0 | W/ | |
| Operating and Storage Temperature | TJ, TSTG | -55 to 175 | |
| Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. Package Body for 10s, See Techbrief 334 |
T L Tpkg |
300 260 |
CAUTION: Stresses above those listed in "Absolute M aximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
These N-Channel power MOSFETs are manufactured using the MegaFET process. RF1S70N03SM, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors RF1S70N03SM can be operated directly from integrated circuits.
Formerly developmental type TA49025.