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RFP6P10

Features: • -6A, -80V and -100V• rDS(ON) = 0.600Ω• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• Majority Carrier Device• Related Literature- TB334 Guidelines for Solderin...

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RFP6P10: Features: • -6A, -80V and -100V• rDS(ON) = 0.600Ω• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Inpu...

RFP6P10 Data Sheet

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Part Number:
RFP6P10
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/27

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Product Details

Description



Features:

• -6A, -80V and -100V
• rDS(ON) = 0.600Ω
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFP6P08 RFP6P10 UNITS
Drain to Source Voltage (Note 1) VDSS 80 100 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 80 100 V
Continuous Drain Current
RMS Continuous ID 6 6 A
Pulsed Drain Current (Note 3) IDM ±20 ±20 V
Maximum Power Dissipation PD ±20 ±20 V
Maximum Power Dissipation PD 60 60 W
Operating and Storage Temperature .TJ, TSTG -55 to 150 -55 to 150 o C
Maximum Temperature for Soldering      
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 300 o C
Package Body for 10s, See Techbrief 334 Tpkg 260 260 o C



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