Purchase RFP8N20L, In-stock RFP8N20L From SeekIC.
MFG:INTESIL Package Cooled:TO-220 D/C:08+
- Table of contents:
RFP8N20L
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Suppliers
DataSheet
General Description
RFP8N20L Maximum Ratings
| RFP8N20L | UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 200 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 200 | V |
| Continuous Drain Current ID | 8 | A |
| Pulsed Drain Current (Note 3) IDM | 20 | A |
| Gate to Source Voltage VGS | 10 | V |
| Maximum Power Dissipation PD | 60 | W |
| Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID | 31 | A |
| Pulsed Avalanche Rating UIS | Figures 6, 14, 15 | |
| Operating and Storage Temperature .TJ, TSTG | -55 to 150 | o C |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | o C |
RFP8N20L Features
• 8A, 200V
• rDS(ON) = 0.600W
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS,TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedence
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
• rDS(ON) = 0.600W
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS,TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedence
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP8N20L
PDF/DataSheet Download
- Datasheet: RFP8N20L
- File Size: 39838 KB
- Manufacturer: ETC [ETC]
- Click here to Download
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- ETC [ETC]
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- HARRIS [Harris Corporation]
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