Features: • Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor• Diffused emitter ballasting resistors improve ruggedness• Interdigitated emitter-base structure provides high emitter efficiency• Gold metallization with barrier realizes v...
RX1214B170W: Features: • Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor• Diffused emitter ballasting resistors improve ruggedness• Interdigitated emitt...
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• Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor
• Diffused emitter ballasting resistors improve ruggedness
• Interdigitated emitter-base structure provides high emitter efficiency
• Gold metallization with barrier realizes very stable characteristics and excellent lifetime
• Multicell geometry improves power sharing and reduces thermal resistance
• Internal input and output prematching networks allow an easier design of circuits.
Intended for use in common-base class C broadband pulsed power amplifiers for radar applications in the 1.2 to 1.4 GHz band. Also suitable for long pulse, heavy duty operation within this band.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VCBO | collector-base voltage | open emitter | - | 65 | V |
| VCES | collector-emitter voltage | RBE =0 | - | 65 | V |
| VCEO | collector-emitter voltage | open base | - | 15 | V |
| VEBO | emitter-base voltage | open collector | - | 3 | V |
| IC | collector current | tp 150 µs; 5% | - | 15 | A |
| Ptot | total power dissipation | Tmb 75 °C; tp 150 µs; 5% | - | 350 | W |
| Tstg | storage temperature | -65 | +200 | °C | |
| Tj | junction temperature | - | 200 | °C | |
| Tsld | soldering temperature | t 10 s; note 1 | - | 235 | °C |
NPN silicon planar epitaxial microwave power transistor in a RX1214B170W metal ceramic flange package, with base connected to flange.