SP8852E

The SP8852E can operate with input frequencies up to 2·7GHz but to obtain optimum performance, good RF layout practices should be used. A suitable layout technique is to use double sided printed circuit board with through plated holes. Wherever possible the top surface on which the SP8852E is mounted should be left as a continuous sheet of copper to form a low impedance ground plane. The ground pins 12 and 16 should be connected directly to the ground plane.

Pins such as VCC and the unused RF input should be decoupled with chip capacitors mounted as close to the device pin as possible, with a direct connection to the ground plane; suitable values are 10nF for the power supplies and <1nF for the RF input pin (a lower value should be used  sufficient to give good decoupling at the RF frequency of operation). A larger decoupling capacitor mounted as close as possible to pin 26 should be used to prevent modulation of VCC by the charge pump pulses. The RSET resistor should also be mounted close to the RSET pin to prevent noise pickup. The capacitor connected from the charge pump output should be a chip component with short connections to the SP8852E. All signals such as the programming inputs, RF IN, REFERENCE IN and the connections to the op-amp are best taken through the pc board adjacent to the SP8852D with through plated holes allowing connections to remote points without fragmenting the ground plane.