STE180NE10

MOSFET N-Ch 100 Volt 180 A

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SeekIC No. : 00160003 Detail

STE180NE10: MOSFET N-Ch 100 Volt 180 A

floor Price/Ceiling Price

Part Number:
STE180NE10
Mfg:
STMicroelectronics
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/23

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 100 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 180 A
Resistance Drain-Source RDS (on) : 0.006 Ohms Configuration : Single Dual Source
Maximum Operating Temperature : + 150 C Mounting Style : Through Hole
Package / Case : ISOTOP Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Drain-Source Breakdown Voltage : 100 V
Mounting Style : Through Hole
Maximum Operating Temperature : + 150 C
Packaging : Tube
Continuous Drain Current : 180 A
Configuration : Single Dual Source
Resistance Drain-Source RDS (on) : 0.006 Ohms
Package / Case : ISOTOP


Features:

 TYPICAL RDS(on) = 4.5 mW
 100% AVALANCHE TESTED
 LOW INTRINSIC CAPACITANCE
 GATE CHARGE MINIMIZED
 REDUCED VOLTAGE SPREAD



Application

 SMPS & UPS
 MOTOR CONTROL
 WELDING EQUIPMENT
 OUTPUT STAGE FOR PWM, ULTRASONIC CIRCUITS



Specifications

Symbol
Parameter
Value
Unit
VCES
Drain-source Voltage (VGS = 0)
100
V

VDGR

Drain- gate Voltage (RGS = 20 kW)

100

V

VGE
Gate-Emitter Voltage
± 20
V

ID

Drain Current (continuous) at TC = 25°C (Steady State)

180

A

ID
Drain Current (continuous) at TC = 100°C
119

A
IDM (*)
Drain Current (pulsed)
540
A
PTOT
Total Dissipation at TC = 25°C (Steady State)
360
W
 
Derating Factor
2.88
W/°C
 VISO
Insulation Winthstand Voltage (AC-RMS) 
2500
V
Tj
Operating Junction Temperature

- 65 to 150

°C

Tstg

Storage Temperature

150

°C




Description

This STE180NE10 Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size]" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.




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