STP16NE06

MOSFET TO-220 N-CH 60V 16A

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STP16NE06 Picture
SeekIC No. : 00162392 Detail

STP16NE06: MOSFET TO-220 N-CH 60V 16A

floor Price/Ceiling Price

Part Number:
STP16NE06
Mfg:
STMicroelectronics
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 16 A
Resistance Drain-Source RDS (on) : 0.1 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : Through Hole
Package / Case : TO-220 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : Through Hole
Packaging : Tube
Package / Case : TO-220
Continuous Drain Current : 16 A
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 0.1 Ohms


Features:

TYPICAL RDS(on) = 0.08
AVALANCHE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
175oC OPERATING TEMPERATURE
HIGH dV/dt CAPABILITY
APPLICATION ORIENTED CHARACTERIZATION



Application

DC MOTOR CONTROL
DC-DC & DC-AC CONVERTERS
SYNCHRONOUS RECTIFICATION



Specifications

Symbol Parameter Value Unit
STP16NE06 STP16NE06FP
VDS Drain-source Voltage (VGS = 0) 60 V
VDGR Drain-gate Voltage (RGS = 20 k ) 60 V
VGS Gate- source Voltage ±20 V
ID Drain Current (continuos) at TC = 25
16
11 A
ID Drain Current (continuos) at TC = 100 10 7 A
IDM() Drain Current (pulsed) 64 64 A
PTOT Total Dissipation at TC = 25 60 30 W
  Derating Factor 0.4 0.2 W/
VISO Insulation Withstand Voltage (DC) ----- 2000 V
dV/dt Peak Diode Recovery voltage slope 6 V/ns
Tstg Storage Temperature 65 to 175
Tj Max. Operating Junction Temperature 175
(•) Pulse width limited by safe operating area   ( 1) ISD  20 A, di/dt   300 A/s, VDD   V(BR)DSS, Tj   TJMAX


Description

This Power Mosfet STP16NE06 is the latest development of SGS-THOMSON unique "Single Feature Size"process whereby a single body is implanted on a strip layout structure. The resulting transistor shows extremely high packing density for low onresistance,rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.




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