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MFG:ST  Package Cooled:TO-220F  D/C:07+  

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Part Number: STP2NC60FP

 

MFG: ST

Package Cooled: TO-220F

D/C: 07+

Description: The PowerMESH™II is the evolution of the first generation of MESH OVERLAY™. The layout ref...


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STP2NC60FP General Description


The PowerMESH™II is the evolution of the first generation of MESH OVERLAY™. The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge for what concerns swithing speed, gate charge and ruggedness.

STP2NC60FP Maximum Ratings

Symbol
Parameter
Value
Unit
STP10NK80Z
STP10NK80ZFP
VDS
Drain-source Voltage (VGS = 0)
700
V
VDGR
Drain- gate Voltage (RGS = 20 k)
700
V
VGS
Gate-Source Voltage
± 30
V
ID
Drain Current (continuous) at Tc = 25
1.9
1.9 (*)
A
ID

Drain Current (continuous) at Tc = 100
1.2
1.2 (*)
A
IDM(`)
Drain Current (pulsed)
7.4
7.4 (*)
A
PTOT(1)
Total Dissipation at Tc = 25
70
30
W
Derating Factor
0.56
0.24
W/
dv/dt
Peak Diode Recovery voltage slope
3.5
V/ns
VISO
Insulation Withstand Voltage (DC)
2000
V
Tstg
Storage Temperature
 -55 to 175  

Tj Operating Junction Temperature 150  
(•)Pulse width limited by safe operating area (1)ISD1.9A, di/dt100A/µs, VDD0V(BR)DSS, Tj0 TJMAX
(*) Limited only by Maximum Temperature Allowed

STP2NC60FP Typical Application

 HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER

STP2NC60FP datasheet

STP2NC60FP
PDF/DataSheet Download

  • Datasheet: STP2NC60FP
  • File Size: 342597 KB
  • Manufacturer: STMICROELECTRONICS [STMicroelectronics]
  • Click here to Download

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