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TPD1044F

Features: • A monolithic power IC with a new structure combining acontrol block and a vertical power MOSFET (L2--MOS) on single chip.• Can directly drive a power load from a CMOS or TTL logic.• Built-in protection circuits against overvoltage (active clamp), overtemperature (ther...

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SeekIC No. : 004526277 Detail

TPD1044F: Features: • A monolithic power IC with a new structure combining acontrol block and a vertical power MOSFET (L2--MOS) on single chip.• Can directly drive a power load from a CMOS or TTL ...

TPD1044F Data Sheet

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Part Number:
TPD1044F
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• A monolithic power IC with a new structure combining a control block and
   a vertical power MOSFET (L2--MOS) on single chip.
• Can directly drive a power load from a CMOS or TTL logic.
• Built-in protection circuits against overvoltage (active clamp),
   overtemperature (thermal shutdown), and overcurrent (current limiter).
• Low Drain-Source ON-resistance: RDS (ON) = 0.6 (max) (@VIN = 5 V, ID = 0.5 A, Tch = 25)
• Low Leakage Current: IDSS = 10 A (max) (@VIN = 0 V, VDS = 30 V, Tch = 25)
• Low Input Current: IIN = 300 A (max) (@VIN = 5 V, Tch = 25)
• "PS-8" package with embossed-tape packing.


Pinout

Connection Diagram


Specifications

Characteristics Symbol Rating Unit
Drain-source voltage VDS(DC) 41 V
Drain current ID Internally Limited A
Input voltage VIN −0.3~7 V
Power dissipation (Note 3) PD 0.9 W
Single pulse active clamp capability (Note 4) EAS 125 mJ
Active clamp current IAR 1 A
Repetitive active clamp capability (Note 5) EAR 0.09 mJ
Operating temperature Topr −40~125  
Channel temperature Tch 150  
Storage temperature Tstg −55~150  



Description

The TPD1044F is a low-side switch.

The TPD1044F IC has a vertical MOSFET output which can be directly driven from a CMOS or TTL logic circuit (e.g., an MPU). The IC is equipped with intelligent self-protection functions.




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