WED2CG472512V-D2

Features: · 4x512Kx72 Synchronous, Synchronous Burst· Flow-Through Architecture· Linear and Sequential Burst Support via MODE pin· Clock Controlled Registered Module Enable (EM)· Clock Controlled Registered Bank Enables (E1,E2, E3, E4)· Clock Controlled Byte Write Mode Enable (BWE)· Clock Controll...

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SeekIC No. : 004545543 Detail

WED2CG472512V-D2: Features: · 4x512Kx72 Synchronous, Synchronous Burst· Flow-Through Architecture· Linear and Sequential Burst Support via MODE pin· Clock Controlled Registered Module Enable (EM)· Clock Controlled Re...

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Part Number:
WED2CG472512V-D2
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

· 4x512Kx72 Synchronous, Synchronous Burst
· Flow-Through Architecture
· Linear and Sequential Burst Support via MODE pin
· Clock Controlled Registered Module Enable (EM)
· Clock Controlled Registered Bank Enables (E1E2, E3, E4)
· Clock Controlled Byte Write Mode Enable (BWE)
· Clock Controlled Byte Write Enables (BW1 - BW8)
· Clock Controlled Registered Address
· Clock Controlled Registered Global Write (GW)
· Asynchronous Output Enable (G)
· Internally Self-Timed Write
· Individual Bank Sleep Mode Enables (ZZ1, ZZ2, ZZ3, ZZ4)
· Gold Lead Finish
· 3.3V ± 10% Operation
· Frequency(s): 100, 83, 67, 50MHz
· Access Speed(s): tKHQV = 9, 10, 12, 15ns
· Common Data I/O
· High Capacitance (30pF) Drive, at Rated Access Speed
·Single Total Array Clock



Pinout

  Connection Diagram


Specifications

Voltage on Vcc Relative to Vss                      -0.3V to +4.6V
Vin                                                         -0.3V to Vcc +0.5V
Storage Temperature                            -55°C to + 125°C
Operating Temperature (Commercial)          0°C to +70°C
Operating Temperature (Industrial)           -40°C to +85°C
Short Circuit Output Current                                     100mA



Description

The WED2CG472512V is a Synchronous/Synchronous Burst SRAM, 84 position Dual Key; Double High DIMM (168 contacts) Module, organized as 4x512Kx72. The Module contains sixteeen (16) Synchronous Burst RAM devices, packaged in the industry standard JEDEC 14mmx20mm TQFP placed on a Multilayer FR4 Substrate. The Module Architecture WED2CG472512V is defined as a Sync/SyncBurst, Flow- Through, with support for either linear or sequential burst. This Module provides high performance, 2-1-1-1 accesses when used in Burst Mode, and when used in Synchronous Only Mode, WED2CG472512V provides a high performance cost advantage over BiCMOS asynchronous device architectures.

Synchronous Only operations WED2CG472512V are performed via strapping ADSC Low, and ADSP/ADV High, which provides for Ultra Fast Accesses in Read Mode while providing for internally self-timed Early Writes.

Synchronous/Synchronous Burst WED2CG472512V operations are in relation to an externally supplied clock, Registered Address, Registered Global Write, Registered Enables as well as an Asynchronous Output Enable. This Module WED2CG472512V has been defined with full flexibility, which allows individual control of each of the eight bytes, as well as Quad Words in both Read and Write Operations.




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