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SiHLL014

Features: • Surface Mount• Available in Tape and Reel• Dynamic dV/dt Rating• Logic-Level Gate Drive• RDS(on) Specified at VGS = 4 V and 5 V• Fast Switching• Ease of Paralleling• Lead (Pb)-free AvailableSpecifications Parameter Symbol L...

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SeekIC No. : 004491196 Detail

SiHLL014: Features: • Surface Mount• Available in Tape and Reel• Dynamic dV/dt Rating• Logic-Level Gate Drive• RDS(on) Specified at VGS = 4 V and 5 V• Fast Switching•...

SiHLL014 Data Sheet

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Part Number:
SiHLL014
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Logic-Level Gate Drive
• RDS(on) Specified at VGS = 4 V and 5 V
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available


Specifications

Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
±10
V
Drain Current-Continuous VGS at 10 V TC=25
ID
2.7
1.7
A
TC=100
Pulsed Drain Currenta
IDM
22
A
Linear Derating Factor
0.025
W/
Linear Derating Factor (PCB Mount)e
0.017
Single Pulse Avalanche Energyb
EAS
100
mJ
Repetitive Avalanche Currenta
IAR
2.7
A
Repetitive Avalanche Energya
EAR
0.31
mJ
Maximum Power Dissipation TC=25
PD
3.1
2.0
W
Ta=25
Peak Diode Recovery dV/dtc
dV/dt
4.5
V/ns
Operating Junction and S torage
Temperature R ange
TJ, TSTG
-55 to 150
Soldering Recommendations (Peak Temperature) for 10 s 300d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 , L = 16 mH, RG = 25 , IAS = 2.7 A (see fig. 12).
c. ISD 10 A, dI/dt 90 A/s, VDD VDS, TJ 150 .
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply


Description

Third generation Power MOSFETs of SiHLL014 from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOT-223 package of SiHLL014 is designed for surface-mounting using vapor phase, infrared, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performace due to an enlarged tab for heatsinking. Power dissipation of greater than 1.25 W is possible in a typical surface mount application.




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