BSP030, BSP090, BSP100 Selling Leads, Datasheet
MFG:Infineon Package Cooled:2008+ROHS D/C:100000
BSP030, BSP090, BSP100 Datasheet download
Part Number: BSP030
MFG: Infineon
Package Cooled: 2008+ROHS
D/C: 100000
BSP030, BSP090, BSP100
- Table of contents:
Info of BSP030
Info of BSP090
Info of BSP100
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About BSP030
PDF/DataSheet Download
Datasheet: BSP030
File Size: 111955 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BSP090
PDF/DataSheet Download
Datasheet: BSP090
File Size: 127048 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BSP100
PDF/DataSheet Download
Datasheet: BSP100
File Size: 114601 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
BSP030 General Description
N-channel enhancement mode vertical D-MOS transistor in a 4-pin plastic SOT223 SMD package.
BSP030 Maximum Ratings
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
VDS |
drain-source voltage (DC) |
30 |
V | ||
|
VGS |
gate-source voltage (DC) |
±20 |
V | ||
|
ID |
drain current (DC) |
Ts = 100 °C; note 1 |
10 |
mA | |
|
IDM |
peak drain current |
note 2 |
40 |
mA | |
|
Ptot |
total power dissipation |
Ts = 100 °C |
5 |
W | |
| Tamb = 25 °C; note 3 |
3.3 | ||||
| Tamb = 25 °C; note 4 | 125 | ||||
|
Tstg |
storage temperature |
-65 |
+150 |
°C | |
|
Tj |
operating junction temperature |
-65
|
+150 |
°C |
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. Value based on printed-circuit board with a R th a-tp (ambient to tie-point) of 27.5 K/W.
4. Value based on printed-circuit board with a R th a-tp (ambient to tie-point) of 90 K/W.
BSP030 Features
· High speed switching
· No secondary breakdown
· Very low on-state resistance.
· No secondary breakdown
· Very low on-state resistance.
BSP030 Typical Application
· Motor and actuator drivers
· Power management
· Synchronized rectification.
BSP030 Connection Diagram
BSP090 General Description
P-channel enhancement mode vertical D-MOS transistor in a 4-pin plastic SOT223 SMD package.
BSP090 Maximum Ratings
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
VDS |
drain-source voltage (DC) |
-30 |
V | ||
|
VGS |
gate-source voltage (DC) |
±20 |
V | ||
|
ID |
drain current (DC) |
Ts = 100 °C; note 1 |
-5.7 |
A | |
|
IDM |
peak drain current |
note 2 |
-22 |
A | |
|
Ptot |
total power dissipation |
Ts = 100 °C |
5 |
W | |
|
Tamb = 25 °C; note 3 |
3.3 |
W | |||
|
Tamb = 25 °C; note 4 |
1.25 |
W | |||
|
Tstg |
storage temperature |
-65 |
+150 |
°C | |
|
TJ |
operating junction temperature |
-65 |
+150 |
°C |
1. Ts is the temperature at the soldering point of the drain lead.
2. Pulse width and duty cycle limited by maximum junction temperature.
3. Device mounted on a printed-circuit board with a R th a-tp (ambient to tie-point) of 27.5 K/W.
4. Device mounted on a printed-circuit board with a R th a-tp (ambient to tie-point) of 90 K/W.
BSP090 Features
· High speed switching
· No secondary breakdown
· Very low on-state resistance
· No secondary breakdown
· Very low on-state resistance
BSP090 Typical Application
· Motor and actuator drivers
· Power management
· Synchronized rectification
· Power management
· Synchronized rectification
BSP100 General Description
N-channel enhancement mode field-effect transistor in a plastic envelope using 'trench'technology.
BSP100 Features
• 'Trench' technology
• Low on-state resistance
• Fast switching
• High thermal cycling performance
• Low thermal resistance
• Low on-state resistance
• Fast switching
• High thermal cycling performance
• Low thermal resistance
BSP100 Typical Application
• Motor and relay drivers
• d.c. to d.c. converters
• Logic level translator
The BSP100 is supplied in the SOT223 surface mounting package
• d.c. to d.c. converters
• Logic level translator
The BSP100 is supplied in the SOT223 surface mounting package
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