BSP205, BSP206, BSP20AT1 Selling Leads, Datasheet
MFG:PHILIPS Package Cooled:. D/C:06+
BSP205, BSP206, BSP20AT1 Datasheet download

Part Number: BSP205
MFG: PHILIPS
Package Cooled: .
D/C: 06+
MFG:PHILIPS Package Cooled:. D/C:06+
BSP205, BSP206, BSP20AT1 Datasheet download

MFG: PHILIPS
Package Cooled: .
D/C: 06+
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PDF/DataSheet Download
Datasheet: BSP205
File Size: 67176 KB
Manufacturer: PHILIPS [Philips Semiconductors]
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PDF/DataSheet Download
Datasheet: BSP206
File Size: 66826 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP20AT1
File Size: 122157 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
P-channel enhancement mode vertical D-MOS transistor in a miniature SOT223 envelope and intended for use in relay, high-speed and line-transformer drivers.
|
Drain-source voltage |
-VDS |
max. |
60 |
V |
|
Gate-source voltage (open drain) |
± VGSO |
max. |
20 |
V |
|
Drain current (DC) |
-ID |
max. |
275 |
mA |
|
Drain current (peak) |
-IDM |
max. |
550 |
mA |
|
Total power dissipation up to Tamb = 25 °C (note 1) |
Ptot |
max. |
1.5 |
W |
|
Storage temperature range |
Tstg |
-65 to + 150 |
°C | |
|
Junction temperature |
Tj |
max. |
150 |
°C |
P-channel enhancement mode vertical D-MOS transistor in a miniature SOT223 envelope and intended for use in relay, high-speed and line-transformer drivers.
|
Drain-source voltage |
-VDS |
max. |
60 |
V |
|
Gate-source voltage (open drain) |
± VGSO |
max. |
20 |
V |
|
Drain current (DC) |
-ID |
max. |
350 |
mA |
|
Drain current (peak) |
-IDM |
max. |
700 |
mA |
|
Total power dissipation up to Tamb = 25 °C (note 1) |
Ptot |
max. |
1.5 |
W |
|
Storage temperature range |
Tstg |
-65 to + 150 |
°C | |
|
Junction temperature |
Tj |
max. |
150 |
°C |
This family of NPN Silicon Epitaxial transistors is designed for use as a general purpose amplifier and in switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.
• High Voltage: V(BR)CEO of 250 and 350 Volts.
• The SOT-223 package can be soldered using wave or reflow.
• SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
• Available in 12 mm Tape and Reel T1 Configuration 7 inch/1000 unit reel T3 Configuration 13 inch/4000 unit reel
• PNP Complement is BSP16T1
|
Parameter |
Symbol |
BSP19A | BSP20A |
Unit |
|
Collector-Base Voltage |
VCBO |
350 |
250 |
V |
|
Collector-Emitter Voltage |
VCEO |
400 |
300 | |
|
Emitter-Base Voltage |
VEBO |
5.0 | ||
|
Collector Current |
IC |
1000 |
A | |
|
Total Device Dissipation, TA = 25°C (1) |
PD |
0.8 6.4 |
Watts mW/°C | |
|
Storage Temperature Range |
Tstg |
65 to 150 |
°C | |
|
Junction Temperature |
Tj |
150 |
°C | |
1. 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.
