BUZ211, BUZ214, BUZ215 Selling Leads, Datasheet
MFG:SIEMENS/INF/ST Package Cooled:PHI,VAL,SIE D/C:04+
BUZ211, BUZ214, BUZ215 Datasheet download

Part Number: BUZ211
MFG: SIEMENS/INF/ST
Package Cooled: PHI,VAL,SIE
D/C: 04+
MFG:SIEMENS/INF/ST Package Cooled:PHI,VAL,SIE D/C:04+
BUZ211, BUZ214, BUZ215 Datasheet download

MFG: SIEMENS/INF/ST
Package Cooled: PHI,VAL,SIE
D/C: 04+
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PDF/DataSheet Download
Datasheet: BUZ10
File Size: 135632 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ214
File Size: 185689 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ215
File Size: 123132 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
| Parameter | Symbol | Values | Unit |
| Drain source voltage | VDS | 500 | V |
| Drain-gate voltage RGS = 20 k |
VDGR | 500 | |
| Continuous drain current TC =30 |
ID | 5 | A |
| Pulsed drain current TC =25 |
IDpuls | 20 | |
| Gate-source voltage | VGS | ± 20 | V |
| Power dissipation TC = 25 |
Ptot | 75 | W |
| Operating temperature | Tj | 55 ... + 150 | |
| Storage temperature | Tstg | 55 ... + 150 | |
| Thermal resistance, chip-case | Rth JC | 1.67 | K/W |
| Thermal resistance, chip to ambient | Rth JA | 75 | |
| DIN humidity category, DIN 40 040 | E | ||
| IEC climatic category, DIN IEC 68-1 | 55/150/56 |
