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BUZ71, BUZ71A, BUZ71AFI

Table of contents:
Info of BUZ71
Info of BUZ71A
Info of BUZ71AFI

BUZ71, BUZ71A, BUZ71AFI Selling Leads, Datasheet

MFG:ST Package Cooled:DIP3 D/C:01+

BUZ71, BUZ71A, BUZ71AFI Datasheet download

Five Points

Part Number: BUZ71

MFG: ST

Package Cooled: DIP3

D/C: 01+

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BUZ71 Maximum Ratings

Parameter	Symbol	Values	Unit
Continuous drain current T_C= 25 °C	I_D	14	A
Pulsed drain current T_C = 25 °C	ID_puls	56
Avalanche current,limited by T_jmax	I_AR	14
Avalanche energy,periodic limited by T_jmax	E_AR	1	mJ
Avalanche energy, single pulse I_D = 14 A, V_DD = 25 V, R_GS = 25 L = 30.6 µH, T_j= 25 °C	E_AS	6	mJ
Gate source voltage	V_GS	± 20	V
Power dissipation T_C = 25 °C	P_tot	40	W
Operating temperature	T_j	55 . + 150	°C
Storage temperature range	T_stg	55 . + 150	°C
Thermal resistance, chip case	R_thJC	1.67	K/W
Thermal resistance, chip to ambient	R_thJA	75	K/W
DIN humidity category, DIN 40 040		E
IEC climatic category, DIN IEC 68-1		55 / 150 / 56

BUZ71 Features

• N channel
• Enhancement mode
• Avalanche-rated

BUZ71A Maximum Ratings

		BUZ71A	UNITS
Drain to Source Breakdown Voltage (Note 1)	V_DS	50	V
Drain to Gate Voltage (R_GS = 20k) (Note 1)	V_DGR	50	V
Continuous Drain Current, T_C= 55	I_D	13	A
Pulsed Drain Current (Note 3)	I_DM	48	A
Gate to Source Voltage	V_GS	±20	V
Maximum Power Dissipation	P_D	40	W
Single Pulse Avalanche Energy Rating (Note 4)	E_AS	100	mJ
Linear Derating Factor		0.32	W/
Operating and Storage Temperature	T_STG, T_J	-55 to 150
DIN Humidity Category - DIN 40040		E
IEC Climatic Category - DIN IEC 68-1		55/150/56
Leads at 0.063in (1.6mm) from Case for 10s	T_L	300
Package Body for 10s, See Techbrief 334	T_pkg	260

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

BUZ71A Features

• 13A, 50V
• r_DS(ON) = 0.120
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

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