BUZ76A, BUZ77, BUZ77A Selling Leads, Datasheet
MFG:ST/SIE/INF Package Cooled:09+ D/C:TO-220
BUZ76A, BUZ77, BUZ77A Datasheet download
Part Number: BUZ76A
MFG: ST/SIE/INF
Package Cooled: 09+
D/C: TO-220
MFG:ST/SIE/INF Package Cooled:09+ D/C:TO-220
BUZ76A, BUZ77, BUZ77A Datasheet download
MFG: ST/SIE/INF
Package Cooled: 09+
D/C: TO-220
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PDF/DataSheet Download
Datasheet: BUZ76A
File Size: 43912 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ77A
File Size: 179260 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUZ77A
File Size: 179260 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
BUZ76A | UNITS | ||
Drain to Source Breakdown Voltage (Note 1) | VDS | 400 | V |
Drain to Gate Voltage (RGS = 20k) (Note 1) | VDGR | 400 | V |
Continuous Drain Current, TC = 30 | ID | 2.6 | A |
Pulsed Drain Current (Note 3) | IDM | 10 | A |
Gate to Source Voltage | VGS | ±20 | V |
Maximum Power Dissipation | PD | 40 | W |
Linear Derating Factor | 0.32 | W/ | |
Operating and Storage Temperature | TSTG, TJ | -55 to 150 | |
DIN Humidity Category - DIN 40040 | E | ||
IEC Climatic Category - DIN IEC 68-1 | 55/150/56 | ||
Leads at 0.063in (1.6mm) from Case for 10s | TL | 300 | |
Package Body for 10s, See Techbrief 334 | Tpkg | 260 |
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Parameter | Symbol | Values | Unit |
Continuous drain current TC = 31 |
ID | 2.7 | A |
Pulsed drain current TC = 25 |
IDpuls | 11 | |
Avalanche current,limited by Tjmax | IAR | 2.7 | |
Avalanche energy,periodic limited by Tjmax |
EAR | 5 | mJ |
Avalanche energy, single pulse ID =2.7A, VDD = 50 V, RGS = 25 L =45.3 mH, Tj = 25 |
EAS | 180 | |
Gate source voltage | VGS | ± 20 | V |
Power dissipation TC = 25 |
Ptot | 75 | W |
Operating temperature | Tj | -55 ... + 150 | |
Storage temperature | Tstg | -55 ... + 150 | |
Thermal resistance, chip case | RthJC | 1.67 | K/W |
Thermal resistance, chip to ambient | RthJA | 75 | |
DIN humidity category, DIN 40 040 | E | ||
IEC climatic category, DIN IEC 68-1 | 55 / 150 / 56 |