MFG:International Rectifier Category:Discrete Semiconductor Products Package Cooled:SOT-23 D/C:08+
IRLML2402TR/1A7P, IRLML2402TRPBF, IRLML2502 Datasheet download
Category: Discrete Semiconductor Products
MFG: International Rectifier
Package Cooled: SOT-23
D/C: 08+
Description: MOSFET N-CH 20V 1.2A SOT-23
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PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRLML2502
File Size: 129735 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
| Technical/Catalog Information | IRLML2402TRPBF |
| Vendor | International Rectifier |
| Category | Discrete Semiconductor Products |
| Mounting Type | Surface Mount |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 20V |
| Current - Continuous Drain (Id) @ 25° C | 1.2A |
| Rds On (Max) @ Id, Vgs | 250 mOhm @ 930mA, 4.5V |
| Input Capacitance (Ciss) @ Vds | 110pF @ 15V |
| Power - Max | 540mW |
| Packaging | Tape & Reel (TR) |
| Gate Charge (Qg) @ Vgs | 3.9nC @ 4.5V |
| Package / Case | SOT-23-3, TO-236-3, Micro3?, SSD3, SST3 |
| FET Feature | Logic Level Gate |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IRLML2402TRPBF IRLML2402TRPBF IRLML2402PBFTR ND IRLML2402PBFTRND IRLML2402PBFTR |
These N-Channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management.
A thermally enhanced large pad leadframe has been incorporated into the standard SOT-23 package to produce a HEXFET Power MOSFET with the industry's smallest footprint. This package, dubbed the Micro3, is ideal for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro3 allows it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards. The thermal resistance and power dissipation are the best available.
| Parameter | Max. | Units | |
| VDS | Drain- Source Voltage | 20 | V |
| ID @ TA = 25°C | Continuous Drain Current, VGS @ 4.5V | 4.2 | A |
| ID @ TA = 70°C | Continuous Drain Current, VGS @ 4.5V | 3.4 | |
| IDM | Pulsed Drain Current | 33 | |
| PD @TA = 25°C | Power Dissipation | 1.25 | W |
| PD @TA = 70°C | Power Dissipation | 0.8 | W |
| Linear Derating Factor(PCB Mount)* | 0.01 | W/°C | |
| VGS | Gate-to-Source Voltage | ±12 | V |
| TJ TSTG | Junction and Storage Temperature Range | -55 to + 150 | °C |
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