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MTP2N80, MTP2P50, MTP2P50E

MTP2N80, MTP2P50, MTP2P50E Selling Leads, Datasheet

MFG:MOT  Package Cooled:TO-220  D/C:03+

MTP2N80, MTP2P50, MTP2P50E Picture

MTP2N80, MTP2P50, MTP2P50E Datasheet download

Five Points

Part Number: MTP2N80

 

MFG: MOT

Package Cooled: TO-220

D/C: 03+

 

 

 
 
 
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About MTP 3-Phase Rectifier Series

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Datasheet: MTP 3-Phase Rectifier Series

File Size: 124897 KB

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MTP2P50 Suppliers

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About MTP2P50

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Datasheet: MTP2P50

File Size: 236539 KB

Manufacturer: MOTOROLA [Motorola, Inc]

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  • MTP2P50EG

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  • MTP10N05

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About MTP2P50E

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Datasheet: MTP2P50E

File Size: 236539 KB

Manufacturer: MOTOROLA [Motorola, Inc]

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MTP2P50 General Description

This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.

MTP2P50 Maximum Ratings

Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
500
Vdc
DraintoGate Voltage (RGS =1.0 M)
VDGR
500
Vdc
GatetoSource Voltage
- Continuous
- NonRepetitive (tp 10 ms)
VGS
VGSM
± 20
± 40
Vdc
VPK
Drain Current
- Continuous
- Continuous@ 100°C
- Single Pulse (tp 10 s)
ID
ID
IDM
2.0
1.6
6.0
Adc

Apk
Total Power Dissipation
Derate above 25°C
PD
75
0.6
Watts
W/°C
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy TJ = 25°C
(VDD =100 Vdc, VGS =10Vdc, PEAK IL =4.0 Apk, L =10H, RG = 25)
EAS
80
mJ
Thermal Resistance
- Junction to Case
- Junction to Ambient
RJC
RJA
1.67
62.5
°C/W

Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds
TL
260
°C
Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves - representing boundaries on device characteristics - are given to facilitate "worst case" design.

EFET and Designer's are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.

MTP2P50 Features

• Robust High Voltage Termination
• Avalanche Energy Specified
• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature

MTP2P50E General Description

This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies,converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.
• Robust High Voltage Termination
• Avalanche Energy Specified
• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature

MTP2P50E Maximum Ratings

Rating
Symbol
Value
Unit
DrainSource Voltage
VGSS
500
Vdc
DrainGate Voltage (RGS = 1.0 M)
VDGR
500
Vdc
GateSource Voltage
- Continuous
- NonRepetitive (tp10ms)

VGS
VGSM

±20
±40


Vdc
Vpk

Drain - Continuous
- Continuous @ 100°C
- Single Pulse(tp10 s)
ID
ID
IDM
2.0
1.6
6.0

Adc

Apk

Total Power Dissipation
Derate above 25°C
PD
75
0.6
Watts
W/°C
Operating and Storage Temperature Range
TJ,Tstg
55 to 150
°C
Single DraintoSource Avalanche
Energy - Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, IL =4.0 Apk, L = 10 mH, RG = 25)
EAS
80
mJ
Thermal Resistance - Junction to Case
- Junction to Ambient
RJC
RJA
1.67
62.5
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8" from case for 10 seconds
TL
260
°C

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