ACT-S128K32V020F2C

Features: `4 Low Power CMOS 128K x 8 SRAMs in one MCM`Overall configuration as 128K x 32`Input and Output TTL Compatible` 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order`Full Military (-55°C to +125°C) Temperature Range` +3.3V Power Supply`Choice of Surface Mount or PGA...

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ACT-S128K32V020F2C Picture
SeekIC No. : 004268112 Detail

ACT-S128K32V020F2C: Features: `4 Low Power CMOS 128K x 8 SRAMs in one MCM`Overall configuration as 128K x 32`Input and Output TTL Compatible` 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order`...

floor Price/Ceiling Price

Part Number:
ACT-S128K32V020F2C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

`4 Low Power CMOS 128K x 8 SRAMs in one MCM
`Overall configuration as 128K x 32
`Input and Output TTL Compatible
` 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order
`Full Military (-55°C to +125°C) Temperature Range
` +3.3V Power Supply
`Choice of Surface Mount or PGA Type Co-fired Packages:
`68Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint)
`66Lead, PGA-Type (P7), 1.08"SQ x .160"max
` Internal Decoupling Capacitors
`DESC SMD# Pending



Pinout

  Connection Diagram


Specifications

Symbol
Rating
Range
Units
TC
Case Operating Temperature
-55 to +125
TSTG
Storage Temperature
-55 to +150
PD
Maximum Package Power Dissipation
P7 Packages
F2 Package
3.0
2.7
W
W
ØJ-C
Hottest Die, Max Thermal Resistance - Junction to Case
P7 Packages
F2 Package
3.0
9.0
/W
/W
VG
Maximum Signal Voltage to Ground
-0.5 to +4.6
V
TL
Maximum Lead Temperature (10 seconds)
300



Description

 SCD3359 REV B 12/17/98 The ACTS128K32V is a High Speed 4 megabit CMOS SRAM Multichip Module (MCM) designed for full temperature range, 3.3V Power Supply, military, space, or high reliability mass memory and fast cache applications.

The MCM of SCD3359 can be organized as a 128K x 32 bits, 256K x 16 bits or 512k x 8 bits device and is input and output TTL compatible. Writing is executed when the write enable (WE) and chip enable (CE ) inputs are low. Reading is accomplished when WE  is high and CE and output enable (OE) are both low. Access time grades of 17ns, 20ns, 25ns, 35ns, 45ns and 55ns maximum are standard.

The products SCD3359 are designed for operation over the temperature range of -55°C to +125°C and screened under the full  military environment.  DESC Standard Military Drawing (SMD) part numbers are pending. 

The SCD3359 is manufactured in Aeroflex's 80,000ft 2   MIL-PRF-38534 certified facility in Plainview, N.Y.




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