MFG:VISHAY Package Cooled:DO-214AA D/C:2009+
MFG: VISHAY
Package Cooled: DO-214AA
D/C: 2009+
Description: DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case is of a transfer-...
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
PRSM |
non-repetitive peak reverse power dissipation | 10/1000 ms exponential pulse (see Fig.4); Tj = 25 °C prior to surge;see also Fig.2 |
- |
300 |
W |
|
Tstg |
storage temperature |
-65 |
+175 |
°C | |
|
Tj |
junction temperature |
-65 |
+175 |
°C |
Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
BZG04-13
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