GP1200FSM18

Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates 1200A Per ModuleApplication High Reliability Inverters Motor Controllers Traction Drives Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units VCES ...

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SeekIC No. : 004354890 Detail

GP1200FSM18: Features: High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates 1200A Per ModuleApplication High Reliability Inverters Motor Controllers Traction Drives Re...

floor Price/Ceiling Price

Part Number:
GP1200FSM18
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

High Thermal Cycling Capability
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates
1200A Per Module



Application

High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters



Pinout

  Connection Diagram


Specifications

Symbol Parameter Test Conditions Max. Units
VCES Collector-emitter voltage VGE = 0V 1800 V
VCES Gate-emitter voltage ±20 V
IC Continuous collector current Tcase = 70°C for Tj = 125°C 1600 A
IC(PK) Peak collector current 1ms, Tcase = 115˚C 2400 A
Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 10.4 kW
Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4000 V



Description

The Powerline range of high power modules GP1200FSM18 includes dualand single switch configurations covering voltages from 600V to 3300V and currents up to 4800A.

The GP1200FSM18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. This device is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.

The GP1200FSM18 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.


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