MFG:IR Package Cooled:D2-PAK D/C:09+
MFG: IR
Package Cooled: D2-PAK
D/C: 09+
Description: Third Generation HEXFETs from International Rectifier provide the designer with the best combination o...
Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The SMD-220 is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The SMD-220 is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
| Parameter | Max. | Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 9.0 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 5.7 | |
| IDM | Pulsed Drain Current | 36 | |
| PD @Tc = 25°C | Power Dissipation | 74 | |
| PD @TC = 25°C | Power Dissipation (PCB Mount)** | 3.1 | W |
| Linear Derating Factor | 0.59 | W/°C | |
| Linear Derating Factor (PCB Mount)** | 0.025 | ||
| VGS | Gate-to-Source Voltage | ±10 | V |
| EAS | Single Pulse Avalanche Energy | 250 | mJ |
| IAR | Avalanche Current | 9.0 | A |
| EAR | Repetitive Avalanche Energy | 7.4 | mJ |
| dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
| TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 | |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case) |
IRL630S
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The IRL630PbF is designed as the third generation HEXFET from international rectifier which provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.The IRL630PbFhas eight features. ...
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