MOSFET 23 Amps 500V 0.2 Rds
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Features: · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mount...
| Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 500 V | ||
| Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 23 A | ||
| Resistance Drain-Source RDS (on) : | 0.2 Ohms | Configuration : | Single | ||
| Maximum Operating Temperature : | + 150 C | Mounting Style : | SMD/SMT | ||
| Package / Case : | ISOPLUS 220LV | Packaging : | Tube |
| Symbol | Test Conditions | Maximum | Ratings |
| VDSS VDGR |
TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 MΩ |
500 500 |
V V |
| VGS VGSM |
Continuous Transient |
±20 ±30 |
V V |
| ID25 IDM IAR |
TC = 25°C 26N50 24N50 TC = 25°C, pulse width limited by TJM 26N50 24N50 TC = 25°C 26N50 24N50 |
23 21 92 84 26 24 |
A A A A A A |
| EAR |
TC = 25°C | 30 | mJ |
| dv/dt | IS IDM, di/dt 100 A/µs, VDD VDSS TJ 150°C, RG = 2 Ω |
5 | V/ns |
| PD | TC = 25°C | 230 | W |
| TJ TJM Tstg |
-55 ... +150 150 -55 ... +150 |
°C °C °C | |
| TL | 1.6 mm (0.062 in.) from case for 10 s | 300 | °C |
| VISOL |
50/60 Hz, RMS t = 1 min leads to tab |
2500 |
V~ |
| Weight | 2 | g |
| Technical/Catalog Information | IXFC26N50 |
| Vendor | IXYS |
| Category | Discrete Semiconductor Products |
| Mounting Type | Through Hole |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 500V |
| Current - Continuous Drain (Id) @ 25° C | 23A |
| Rds On (Max) @ Id, Vgs | 230 mOhm @ 13A, 10V |
| Input Capacitance (Ciss) @ Vds | 4200pF @ 25V |
| Power - Max | 230W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 135nC @ 10V |
| Package / Case | ISOPLUS220? |
| FET Feature | Standard |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IXFC26N50 IXFC26N50 |