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M5M51008BFP

Features: `Low stand-by current 0.3A (typ.)`Directly TTL compatible : All inputs and outputs`Easy memory expansion and power down by S1,S2`Data hold on +2V power supply`Three-state outputs : OR - tie capability`OE prevents data contention in the I/O bus`Common data I/O`Package M5M51008BFP ````````...

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SeekIC No. : 004406245 Detail

M5M51008BFP: Features: `Low stand-by current 0.3A (typ.)`Directly TTL compatible : All inputs and outputs`Easy memory expansion and power down by S1,S2`Data hold on +2V power supply`Three-state outputs : OR - ti...

M5M51008BFP Data Sheet

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Part Number:
M5M51008BFP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

`Low stand-by current 0.3A (typ.)
`Directly TTL compatible : All inputs and outputs
`Easy memory expansion and power down by S1,S2
`Data hold on +2V power supply
`Three-state outputs : OR - tie capability
`OE prevents data contention in the I/O bus
`Common data I/O
`Package M5M51008BFP ```````````` 32pin 525mil SOP M5M51008BVP,RV ```````````` 32pin 8 X 20 mm TSOPM5M51008BKV,KR ```````````` 32pin 8 X 13.4 mm TSOP


Application

Small capacity memory units


Pinout

Connection Diagram


Specifications

Symbol
Parameter
Conditions
Ratings
Unit
VCC
 Supply voltage With respect to GND
0.3*~4.6
V
Vi
 Input voltage
0.3*~Vcc + 0.3
(Max 4.6)
V
VO
 Output voltage
0~VCC
V
PD
 Power dissipation
Ta=25
700
mW
TOPR
 Operating temperature  
-40~85
TSTG
 Storage temperature  
-65~150



Description

The M5M51008BFP,VP,RV,KV,KR are a 1048576-bit CMOS static RAM organized as 131072 word by 8-bit which are fabricated using high-performance triple polysilicon CMOS technology. The use of resistive load NMOS cells and CMOS periphery result in a high density and low power static RAM. They are low standby current and low operation current and ideal for the battery back-up application.

The M5M51008BVP,RV,KV,KR are packaged in a 32-pin thin small outline package which is a high reliability and high density surface mount device(SMD).Two types of devices are available.

VP,KV(normal lead bend type package),RV,KR(reverse lead bend type package). Using both types of devices, it becomes very easy to design a printed circuit board.




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