Features: • 14,16 or 20 terminal package• Isolated, bussed or TTL-terminator circuits• Molded case construction• Highly stable thick film elements• Reflow solderable• Compatible with automatic surface mounting equipment• Reduces total assembly costs•...
SOMC: Features: • 14,16 or 20 terminal package• Isolated, bussed or TTL-terminator circuits• Molded case construction• Highly stable thick film elements• Reflow solderable...
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