Features: ` TYPICAL RDS(on) = 7.3 ` EXTREMELY HIGH dv/dt CAPABILITY` 100% AVALANCHE TESTED` GATE CHARGE MINIMIZED` VERY LOW INTRINSIC CAPACITANCESApplication· SINGLE-ENDED SMPS IN MONITORS, COMPUTER AND INDUSTRIAL APPLICATION· WELDING EQUIPMENTSpecifications Symbol Parameter Value Unit...
STP2NC70ZFP: Features: ` TYPICAL RDS(on) = 7.3 ` EXTREMELY HIGH dv/dt CAPABILITY` 100% AVALANCHE TESTED` GATE CHARGE MINIMIZED` VERY LOW INTRINSIC CAPACITANCESApplication· SINGLE-ENDED SMPS IN MONITORS, COMPUTER...
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| Symbol | Parameter |
Value |
Unit | ||
|
STP2NC70Z |
STP2NC70ZFP |
STD1NC70Z STD1NC70Z-1 | |||
| VDS | Collector-Source Voltage (VGS = 0 V) |
700 |
V | ||
| VDGR | Drain-gate Voltage (RGS = 20 k) |
700 |
V | ||
| VGS | Gate-Source Voltage |
±25 |
V | ||
| ID | Drain Current (continuous) at TC = 25 |
1.4 |
1.4(*) |
1.4 |
A |
| ID | Drain Current (continuous) at TC = 100 |
0.9 |
0.9(*) |
0.9 |
A |
| IDM(`) | Drain Current (pulsed) |
5.6 |
5.6(*) |
5.6 |
A |
| Ptot | Total Dissipation at TC = 25 |
50 |
25 |
45 |
W |
| Derating Factor |
0.4 |
0.2 |
0.36 |
W/ | |
| IGS | Gate-source Current (DC) |
±50 |
mA | ||
| VESD(G-S) | Gate source ESD(HBM-C=100pF, R=1.5K) |
2000 |
V | ||
| dv/dt(1) | Peak Diode Recovery voltage slope |
3 |
V/ns | ||
| Tj Tstg |
Operating Junction Temperature Storage Temperature |
-65 to 150 -65 to 150 |
| ||
The third generation of MESH OVERLAY™ Power MOSFETs STP2NC70ZFP for very high voltage exhibits unsurpassed on-resistance per unit area while integrating back-to-back Zener diodes between gate and source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.