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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXTH50N20 Features
·International standard packages ·Low RDS (on) HDMOSTM process ·Rugged polysilicon gate cell structure ·Low package inductance (< 5 nH) - easy to drive and to protect ·Fast switching times
IXTH50N20 Typical Application
·Switch-mode and resonant-mode power supplies ·Motor controls ·Uninterruptible Power Supplies (UPS) ·DC choppers
IXTH50P085 Parameters
Technical/Catalog Information
IXTH50P085
Vendor
IXYS
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
P-Channel
Drain to Source Voltage (Vdss)
85V
Current - Continuous Drain (Id) @ 25° C
50A
Rds On (Max) @ Id, Vgs
55 mOhm @ 500mA, 10V
Input Capacitance (Ciss) @ Vds
4200pF @ 25V
Power - Max
300W
Packaging
Tube
Gate Charge (Qg) @ Vgs
150nC @ 10V
Package / Case
TO-247AD
FET Feature
Standard
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
IXTH50P085 IXTH50P085
IXTH50P085 Features
• International standard package JEDEC TO-247 AD • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure • Unclamped Inductive Switching (UIS) rated • Low package inductance (<5 nH) - easy to drive and to protect
IXTH50P085 Typical Application
• High side switching • Push-pull amplifiers • DC choppers • Automatic test equipment
