DO-214AC BZG04-13 surface mountable package with glass passivated chip.The well-defined void-free case of BZG04-13 is of a transfer-moulded thermo-setting plastic.
DO-214AC BZG04-12 surface mountable package with glass passivated chip.The well-defined void-free case of BZG04-12 is of a transfer-moulded thermo-setting plastic.
DO-214AC BZG04-11 surface mountable package with glass passivated chip.The well-defined void-free case of BZG04-11 is of a transfer-moulded thermo-setting plastic.