DIODE SCHOTTKY 600V 5A WAFER
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| Series: | - | Manufacturer: | Infineon Technologies | ||
| Diode Type: | Silicon Carbide Schottky | Voltage - DC Reverse (Vr) (Max): | 600V | ||
| Current - Average Rectified (Io): | 5A (DC) | Current - Average Rectified (Io) (per Diode): | - | ||
| Voltage - Forward (Vf) (Max) @ If: | 1.7V @ 5A | Speed: | No Recovery Time > 500mA (Io) | ||
| Reverse Recovery Time (trr): | 0ns | Drain Current (Idss at Vgs=0) : | 10 mA to 18 mA | ||
| Current - Reverse Leakage @ Vr: | 200µA @ 600V | Capacitance @ Vr, F: | 170pF @ 1V, 1MHz | ||
| Diode Configuration: | - | Mounting Type: | Surface Mount | ||
| Package / Case: | Wafer | Supplier Device Package: | Sawn on foil |
|
Parameter |
Symbol |
Condition |
Value |
Unit |
| Repetitive peak reverse voltage |
VRRM |
600 |
V
| |
| Non repetitive peak forward current |
VRSM |
600 | ||
| Continuous forward current limited by Tjmax |
IF |
5 |
A | |
| Single pulse forward current (depending on wire bond configuration) |
IFSM |
TC =25° C, tP =10 ms sinusoidal |
18.5 | |
| Maximum repetitive forward current limited by Tjmax |
IFRM |
TC = 100°C, Tj=150°C, D=0.1 |
21 | |
| Non repetitive peak forward current |
IFMAX |
TC =25°C, tp=10s |
50 | |
| Operating junction and storage temperature |
Tj,Tstg |
-55...+175 |
°C |