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FQI10N60C, FQI11N40, FQI11N40C

FQI10N60C, FQI11N40, FQI11N40C Selling Leads, Datasheet

Package Cooled:TO-262  D/C:09+

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FQI10N60C, FQI11N40, FQI11N40C Datasheet download

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Part Number: FQI10N60C

 

MFG: --

Package Cooled: TO-262

D/C: 09+

 

 

 
 
 
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About FQI10N60C

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Datasheet: FQI10N60C

File Size: 628913 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI11N40

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Datasheet: FQI11N40

File Size: 580533 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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Datasheet: FQI11N40C

File Size: 637417 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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FQI10N60C General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switched mode power supplies, active power factor correction, electronic lamp ballasts based on half bridge topology.

FQI10N60C Maximum Ratings

Symbol Parameter
FQB10N60C / FQI10N60C
Units
VDSS Drain-Source Voltage
600
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
9.5
A
3.3
A
IDM Drain Current - Pulsed (Note 1)
38
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
700
mJ
IAR Avalanche Current (Note 1)
9.5
A
EAR Repetitive Avalanche Energy (Note 1)
15.6
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
156
W
1.25
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI10N60C Features

• 9.5A, 600V, RDS(on) = 0.73Ω @VGS = 10 V
• Low gate charge ( typical 44 nC)
• Low Crss ( typical 18 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FQI11N40 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply, electronic lamp ballast based on half bridge.

FQI11N40 Maximum Ratings

Symbol Parameter
FQB11N40 / FQI11N40
Units
VDSS Drain-Source Voltage
400
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
11.4
A
7.2
A
IDM Drain Current - Pulsed (Note 1)
46
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
520
mJ
IAR Avalanche Current (Note 1)
11.4
A
EAR Repetitive Avalanche Energy (Note 1)
14.7
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
147
W
1.18
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI11N40 Features

• 11.4A, 400V, RDS(on) = 0.48Ω @VGS = 10 V
• Low gate charge ( typical 27 nC)
• Low Crss ( typical 20 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FQI11N40C General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switched mode power supplies, active power factor correction, electronic lamp ballasts based on half bridge topology.

FQI11N40C Maximum Ratings

Symbol Parameter
FQB11N40C / FQI11N40C
Units
VDSS Drain-Source Voltage
400
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
10.5
A
6.6
A
IDM Drain Current - Pulsed (Note 1)
42
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
360
mJ
IAR Avalanche Current (Note 1)
11
A
EAR Repetitive Avalanche Energy (Note 1)
13.5
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
4.5
V/ns
PD Power Dissipation (TA = 25°C) *
4.5
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
135
W
1.07
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI11N40C Features

• 10.5 A, 400V, RDS(on) = 0.5 Ω @VGS = 10 V
• Low gate charge ( typical 28 nC)
• Low Crss ( typical 85pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

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