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FQI13N10, FQI13N10L, FQI13N50

FQI13N10, FQI13N10L, FQI13N50 Selling Leads, Datasheet

Package Cooled:TO-262  D/C:TO

FQI13N10, FQI13N10L, FQI13N50 Picture

FQI13N10, FQI13N10L, FQI13N50 Datasheet download

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Part Number: FQI13N10

 

MFG: --

Package Cooled: TO-262

D/C: TO

 

 

 
 
 
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About FQI13N10

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Datasheet: FQI13N10

File Size: 643929 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI13N10L

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Datasheet: FQI13N10L

File Size: 578444 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI13N50

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Datasheet: FQI13N50

File Size: 639291 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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FQI13N10 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
 
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the av alanche and commutation modes. These devices are  well suited for low voltage applications such as audio amplifier, high efficiency switching DC/DC converters, and DC motor control.

FQI13N10 Maximum Ratings

Symbol Parameter
FQB13N10 / FQI13N10
Units
VDSS Drain-Source Voltage
100
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
12.8
A
9.05
A
IDM Drain Current - Pulsed (Note 1)
51.2
A
VGSS Gate-Source Voltage
± 25
V
EAS Single Pulsed Avalanche Energy (Note 2)
95
mJ
IAR Avalanche Current (Note 1)
12.8
A
EAR Repetitive Avalanche Energy (Note 1)
6.5
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
6.0
V/ns
PD Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
65
W
0.43
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+175
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI13N10 Features

• 12.8A, 100V, RDS(on) = 0.18Ω @VGS = 10 V
• Low gate charge ( typical 12 nC)
• Low Crss ( typical 20 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating

FQI13N10L General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
 
This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation modes. These devices are well suited for low voltage applications such as high efficiency switching DC/DC converters, and DC motor control.

FQI13N10L Maximum Ratings

Symbol Parameter
FQB13N10L / FQI13N10L
Units
VDSS Drain-Source Voltage
100
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
12.8
A
9.05
A
IDM Drain Current - Pulsed (Note 1)
51.2
A
VGSS Gate-Source Voltage
± 20
V
EAS Single Pulsed Avalanche Energy (Note 2)
95
mJ
IAR Avalanche Current (Note 1)
12.8
A
EAR Repetitive Avalanche Energy (Note 1)
6.5
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
6.0
V/ns
PD Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
65
W
0.43
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+175
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI13N10L Features

• 12.8A, 100V, RDS(on) = 0.18Ω @VGS = 10 V
• Low gate charge ( typical 8.7 nC)
• Low Crss ( typical 20 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating

FQI13N50 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
 
This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply, power factor correction, and electronic lamp ballast based on half bridge.

FQI13N50 Maximum Ratings

Symbol Parameter
FQB13N50 / FQI13N50
Units
VDSS Drain-Source Voltage
500
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
12.5
A
7.9
A
IDM Drain Current - Pulsed (Note 1)
50
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
810
mJ
IAR Avalanche Current (Note 1)
12.5
A
EAR Repetitive Avalanche Energy (Note 1)
17
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
170
W
1.35
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI13N50 Features

• 12.5A, 500V. RDS(on) = 0.43Ω @VGS = 10 V
• Low gate charge ( typical 45 nC).
• Low Crss ( typical 25 pF).
• Fast switching.
• 100% avalanche tested.
• Improved dv/dt capability.

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