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FQI2P40, FQI30N06, FQI32N12V2

FQI2P40, FQI30N06, FQI32N12V2 Selling Leads, Datasheet

Package Cooled:TO-262  D/C:TO

FQI2P40, FQI30N06, FQI32N12V2 Picture

FQI2P40, FQI30N06, FQI32N12V2 Datasheet download

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Part Number: FQI2P40

 

MFG: --

Package Cooled: TO-262

D/C: TO

 

 

 
 
 
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About FQI2P40

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Datasheet: FQI2P40

File Size: 600665 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI30N06

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Datasheet: FQI30N06

File Size: 679267 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI32N12V2

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Datasheet: FQI32N12V2

File Size: 664630 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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FQI2P40 General Description

These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. These devices are well suited for electronic lamp ballasts based on the complementary half bridge topology.

FQI2P40 Maximum Ratings

Symbol Parameter
FQB2P40 / FQI2P40
Units
VDSS Drain-Source Voltage
-400
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
-2.0
A
-1.27
A
IDM Drain Current - Pulsed (Note 1)
-8.0
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
120
mJ
IAR Avalanche Current (Note 1)
-2.0
A
EAR Repetitive Avalanche Energy (Note 1)
6.3
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
-4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
63
W
0.51
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI2P40 Features

• -2.0A, -400V, RDS(on) = 6.5Ω @VGS = -10 V
• Low gate charge ( typical 10 nC)
• Low Crss ( typical 6.5 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FQI30N06 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, DC/ DC converters, and high efficiency switching for power management in portable and battery operated products.

FQI30N06 Maximum Ratings

Symbol Parameter
FQB30N06 / FQI30N06
Units
VDSS Drain-Source Voltage
60
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
30
A
21.3
A
IDM Drain Current - Pulsed (Note 1)
120
A
VGSS Gate-Source Voltage
±25
V
EAS Single Pulsed Avalanche Energy (Note 2)
280
mJ
IAR Avalanche Current (Note 1)
30
A
EAR Repetitive Avalanche Energy (Note 1)
7.9
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
7.0
V/ns
PD Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
79
W
0.53
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+175
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI30N06 Features

• 30A, 60V, RDS(on) = 0.04Ω @VGS = 10 V
• Low gate charge ( typical 19 nC)
• Low Crss ( typical 40 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating

FQI32N12V2 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.
 
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for DC to DC converters, sychronous rectification, and other applications lowest Rds(on) is required.

FQI32N12V2 Maximum Ratings

Symbol Parameter
FQB32N12V2/FQI32N12V2
Units
VDSS Drain-Source Voltage
120
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
32
A
23
A
IDM Drain Current - Pulsed (Note 1)
128
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
469
mJ
IAR Avalanche Current (Note 1)
32
A
EAR Repetitive Avalanche Energy (Note 1)
15
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
150
W
1
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+175
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI32N12V2 Features

• 32A, 120V, RDS(on) = 0.05Ω @VGS = 10 V
• Low gate charge ( typical 41 nC)
• Low Crss ( typical 70 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

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