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FQI4P25, FQI4P40, FQI50N06

FQI4P25, FQI4P40, FQI50N06 Selling Leads, Datasheet

MFG:FAIRCHILD  Package Cooled:TO  D/C:TO

FQI4P25, FQI4P40, FQI50N06 Picture

FQI4P25, FQI4P40, FQI50N06 Datasheet download

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Part Number: FQI4P25

 

MFG: FAIRCHILD

Package Cooled: TO

D/C: TO

 

 

 
 
 
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About FQI4P25

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Datasheet: FQI4P25

File Size: 593139 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI4P40

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Datasheet: FQI4P40

File Size: 657843 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About FQI50N06

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Datasheet: FQI50N06

File Size: 663613 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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FQI4P25 General Description

These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand a high energy pulse in the avalanche and commutation modes. These devices are well suited for high efficiency switching DC/DC converters.

FQI4P25 Maximum Ratings

Symbol Parameter
FQB4P25 / FQI4P25
Units
VDSS Drain-Source Voltage
-250
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
-4.0
A
-2.53
A
IDM Drain Current - Pulsed (Note 1)
-16
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
280
mJ
IAR Avalanche Current (Note 1)
-4.0
A
EAR Repetitive Avalanche Energy (Note 1)
7.5
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
-5.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
75
W
0.6
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI4P25 Features

• -4.0A, -250V, RDS(on) = 2.1Ω @VGS = -10 V
• Low gate charge ( typical 10 nC)
• Low Crss ( typical 10.3 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FQI4P40 General Description

These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for electronic lamp ballast based on complimentary half bridge.

FQI4P40 Maximum Ratings

Symbol Parameter
FQB4P40 / FQI4P40
Units
VDSS Drain-Source Voltage
-400
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
-3.5
A
-2.2
A
IDM Drain Current - Pulsed (Note 1)
-14
A
VGSS Gate-Source Voltage
± 30
V
EAS Single Pulsed Avalanche Energy (Note 2)
260
mJ
IAR Avalanche Current (Note 1)
-3.5
A
EAR Repetitive Avalanche Energy (Note 1)
8.5
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
-4.5
V/ns
PD Power Dissipation (TA = 25°C) *
3.13
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
85
W
0.68
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+150
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI4P40 Features

• -3.5A, -400V, RDS(on) = 3.1Ω @VGS = -10 V
• Low gate charge ( typical 18 nC)
• Low Crss ( typical 11 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FQI50N06 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as automotive, DC/ DC converters, and high efficiency switching for power management in portable and battery operated products.

FQI50N06 Maximum Ratings

Symbol Parameter
FQB50N06 / FQI50N06
Units
VDSS Drain-Source Voltage
60
V
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
50
A
35.4
A
IDM Drain Current - Pulsed (Note 1)
200
A
VGSS Gate-Source Voltage
± 25
V
EAS Single Pulsed Avalanche Energy (Note 2)
490
mJ
IAR Avalanche Current (Note 1)
50
A
EAR Repetitive Avalanche Energy (Note 1)
12
mJ
dv/dt Peak Diode Recovery dv/dt (Note 3)
7.0
V/ns
PD Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
- Derate above 25°C
120
W
0.8
W/°C
TJ, TSTG Operating and Storage Temperature Range
-55to+175
°C
TL Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C

FQI50N06 Features

• 50A, 60V, RDS(on) = 0.022Ω @VGS = 10 V
• Low gate charge ( typical 31 nC)
• Low Crss ( typical 65 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating

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